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- Complete Schematics
- Mechanical board outline specification including:
- All mechanical dimensions including critical top and bottom component locations.
- All critical connector locations and their pin-one position and orientation.
- All placement and routing keep-ins and keep-outs
- Bill-of-Materials including Manufacturer's part numbers for all new components and related drawings if not readily available on the web.
- Test Point requirements
- Library created requirements (require DGCD to create symbols or geometries)
- Board technology requirements
- One sided or two sided
- Blind/buried vias
- Special materials (Nelco/Rogers)
- Critical design rules
- Line width and spacing
- Identify high speed (>GHz)
- Length matching criteria
- Layer assignments for major busses.
- Stack-up drawing
- Schedule
- Block diagram outlining
- Major technologies (processors, memories, I/O, etc…)
- Complex chip packages and connectors (large, fine-pitch BGAs, Backplane connectors, DIMMs, etc…)
- Power requirements including potential plane splits
- Number of high speed signals; how many are length critical.
- Board dimensions including thickness and any known part placement information
- Partial Bill-of-Material for critical customer specified parts.
- Schedule
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